Pb free products of DPA423R

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Dear PI, This is SoonYoung in OTIS Engineering Center in Korea. Our product used DPA423-R package. And I would like to know whether Pb free products of DPA423 R and S package or not. I knew R and S package don't have any plan at last year. Do you have any plan this year? Thanks and best regards SY

Hello SY

I've requested information - will get back and post once I have an answer.

Cheers

PI-Chekov

Hello SY,

your requested information is below

Cheers

PI-Chekov

Unfortunately the R package does not support higher temperature lead-free soldering profile and cannot therefore be converted to lead-free. S PAK had to be withdrawn from manufacture last year when the packaging company indicated that they would no longer support this type of device. DPA425GN/PN DIP packages are both lead-free may be an alternative to the R package DPA423R. While they have higher thermal impedance they have lower dissipation. Please contact your local PI sales office (http://www.powerint.com/en/company/sales-information/worldwide-sales-support-locations) to discuss options and how these devices can be used with heatsinks if necessary.